Infineon Technologies CYPRESS Traveo Series Manual page 19

TEQFP176
4.2.2
Figure 4-5: TEQFP176
Package Type
TEQFP 176pin
0.20 C A-B D
TOP VIEW
2
DETAIL A
A
A1
11 e
SID E VIEW
DIM ENSION
SYM BOL
M IN.
A
0.05
A 1
26.00 BSC
D
D 1
D 2
D 3
26.00 BSC
E
24.00 BSC
E 1
E 2
E 3
0.08
R 1
0.08
R 2
θ 0°
0.09
c
0.17
b
0.45
L
L 1
L 2
e
Document Number: 002-10634 Rev. *J
Package Code
LEV176
4
D
5 7
D1
E1 E
0.20 C A-B D
A
SEATI N G
PLA N E
A'
0.08 C
b 0.08 C A-B D
8
NOM . M AX.
1.70
0.15
24.00 BSC
6.65 REF
5.45 REF
6.65 REF
5.45 REF
0.20
2° 8°
0.20
0.22 0.27
0.60 0.75
1.00 REF
0.25
0.50 BSC
D2
D3
EXPOSED PAD
BOTTO M VIEW
R1
L2
c
GAUGE 10
PLA N E
R2
θ
L
L1
DETAIL A
S6J3350 Series
E3 E2
b
SECTION A -A'
002-13653 **
PACKAGE OUTLINE, 176 LEAD TEQFP
24.0X24.0X1.7 M M LEV176 REV**
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