Infineon Technologies CYPRESS Traveo Series Manual page 20

TEQFP144
4.2.3
Figure 4-6: TEQFP144 (0.5mm Pitch)
Package Type
TEQFP 144pin
0.20 C A-B D
2
DETAIL A
A
A1
e
11
SIDE VIEW
SYM BOL
M IN.
A
0.05
A 1
D
D 1
D 2
D 3
E
E 1
E 2
E 3
0.08
R 1
0.08
R 2
θ 0°
0.09
c
0.17
b
0.45
L
L 1
L 2
e
Document Number: 002-10634 Rev. *J
Package Code
LEX144
4
D
5 7
D1
E1 E
0.20 C A-B D
TOP VIEW
A
SEATING
PLANE
A'
0.08 C
b
0.08 C A-B D
8
DIM ENSION
NOM . M AX.
1.70
0.15
22.00 BSC
20.00 BSC
5.80 REF
4.60 REF
22.00 BSC
20.00 BSC
5.80 REF
4.60 REF
0.20
4° 8°
0.20
0.22 0.27
0.60 0.75
1.00 REF
0.25
0.50 BSC
D2
D3
EXPOSED PAD
BOTTOM VIEW
R1
L2
θ GAUGE c
10
PLANE
R2
L
SECTION A-A'
L1
DETAIL A
S6J3350 Series
E3 E2
b
002-13553 **
PACKAGE OUTLINE, 144 LEAD TEQFP
20.0X20.0X1.7 M M LEX144 REV**
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