Table of Contents
Advertisement
Thermal Specifications
Figure 6-1.Quad-Core Intel® Xeon® E7300 Processor Thermal Profile
Notes:
1.
Please refer to
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
4.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
5.
Power specifications are defined at all VIDs found in
Processor may be shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-2.
Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table
Power (W)
Document Number: 318080-002
70.0
60.0
50.0
40.0
30.0
20.0
0
10
20
Table 6-2
for discrete points that constitute the thermal profile.
T
CASE_MAX
0
45.0
10
47.6
20
50.3
30
52.9
40
55.5
50
58.2
60
60.8
70
63.4
80
66.0
Therm al Profile
T
= 0.263 x Pow er + 45
case
30
40
50
Pow er(W)
Section 6.2
Table
2-3. The Quad-Core Intel® Xeon® E7300
(° C)
60
70
80
for details on TCC activation).
.
CASE
97
Advertisement
Table of Contents
