Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300
Series Thermal Profile A
65
60
55
50
T
45
40
0
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B
for the Quad-Core Intel® Xeon® Processor X5300 Series. From
sigma (mean+3sigma) performance of the thermal solution is computed to be
0.249 °C/W and the processor local ambient temperature (T
is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-9.y = 0.249x + 40
where,
y = Processor T
x = Processor power value (W)
Figure 2-20
Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B
specification. The 1U CEK solution meets the Thermal Profile B with 2.3°C margin at
the lower end (P
explained in
activation and measurable performance loss for the processor.
44
T @ TDP
CASE_MAX_A
@ P
CASE_MAX_A
_PROFILE_MIN_A
5 10 15 20 25 30
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
) and 0.1 °C margin at the upper end (TDP). However, as
_PROFILE_MIN
Section 2.2.7, designing to Thermal Profile B results in increased TCC
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
Thermal Profile A
Y = 0.171 * X + 42.5
35 40 45 50 55 60 65
P Power (W)
_PROFILE_MIN_A
2U+ CEK Reference Solution
Y = 0.190 * X + 40
110
70 75 80 90 100
TDP
Table 2-4 the three-
) for this thermal solution
LA
120