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5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements
6.
These values only apply to the B-step of the Dual-Core Intel® Xeon® Processor 5160. For the G-step
specifications, please refer to
Figure 6-4.Dual-Core Intel® Xeon® Processor 5160 Thermal Profiles A and B
70
70
65
65
60
60
55
55
50
50
45
45
40
40
10
10
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (See
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to
discrete points that constitute the thermal profile.
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor's thermal specifications and may result in permanent damage to the processor.
5.
Refer to the Dual-Core Intel
system and environmental implementation details.
6.
This Thermal Profile apply to the B-step of the Dual-Core Intel® Xeon® Processor 5160 only.
Table 6-9.
Dual-Core Intel® Xeon® Processor 5160 Thermal Profile A Table (Sheet 1 of
2)
Power (W)
P
_PROFILE_MIN_A
80
Table
6-1.
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
not significantly exceed TCASE_MAX_A due to TCC activation.
TCASE_MAX_B@TDP
TCASE_MAX_B@TDP
TCASE_MAX_A@TDP
TCASE_MAX_A@TDP
Thermal Profile B
Thermal Profile B
Y = 0.282*x +42.4
Y = 0.282*x +42.4
15
15
20
20
25
25
30
30
®
®
Xeon
Processor 5100 Series Thermal/Mechanical Design Guidelines for
T
CASE_MAX
=36.8
50.0
40
50.7
45
51.9
50
53.1
55
54.2
60
55.4
65
56.5
35
35
40
40
45
45
50
50
55
55
Power [W]
Power [W]
Section 6.2
(°C)
®
Dual-Core Intel
Xeon
Thermal Specifications
Thermal Profile A
Thermal Profile A
Y = 0.231*x +41.5
Y = 0.231*x +41.5
60
60
65
65
70
70
75
75
Table 6-9
for details on TCC activation).
Table 6-10
®
Processor 5100 Series Datasheet
80
80
for
for
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