Intel ® Xeon ® Processor 3400 Series (95W) Thermal Profile - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Sensor Based Thermal Specification Design Guidance
7.2.1 TTV Thermal Profile
For the sensor-based specification the only reference made to a case temperature
measurement is on the TTV. Functional thermal validation will not require the user to
apply a thermocouple to the processor package or measure processor power.
Note: All functional compliance testing will be based on fan speed response to the reported
DTS values above T
will be necessary.
A knowledge of the system boundary conditions is necessary to perform the heatsink
validation.
The TTV is placed in the socket and powered to the recommended value to simulate the
TDP condition. See
series (95W) TTV thermal profile.
®
Figure 7-2. Intel Xeon
75.0
70.0
65.0
60.0
55.0
50.0
45.0
40.0
Note: This graph is provided as a reference, the complete thermal specification is in
Chapter
7.2.2 Specification When DTS value is Greater than T
The product specification provides a table of Ψ
DTS = -1 as a function of T
points, a linear interpolation can be done for any DTS value reported by the processor.
The fan speed control algorithm has enough information using only the DTS value and
T
AMBIENT
part on the thermal profile.
Thermal/Mechanical Specifications and Design Guidelines
. As a result no conversion of TTV T
CONTROL
Section 7.3.1 will provide more detail on defining the boundary conditions.
Figure 7-2 for an example of the Intel
®
Processor 3400 Series (95W) Thermal Profile
TTV Thermal Profile
Y = Power x 0.29 + 45.1
0 20
6.
AMBIENT
to command the thermal solution to provide just enough cooling to keep the
®
40 60
TTV Power (W)
values at DTS = T
CA
(inlet to heatsink). Between these two defined
to processor T
CASE CASE
Xeon ® processor 3400
80 100
CONTROL
and
CONTROL
55