Power Measurement; Thermal Limitations And Protection - Intel Agilex F Series User Manual

A. Development Kit Components
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A.13. Power Measurement
There are eight power supply rails that have on-board voltage, current, and wattage
sense capabilities. An I
Intel MAX 10 system controller for power telemetry data reporting. The V
FPGA core power is measured by the Intel MAX 10 using the SPI bus interface
between the Intel MAX 10 and VCC core controller. The Intel MAX 10 provides power
data through the Power Monitor GUI.
Figure 31. Power Monitor GUI
A.14. Thermal Limitations and Protection
The Intel Agilex FPGA development kit is designed to operate in a typical laboratory
environment with an ambient temperature of approximately 25 °C. The cooling
solution provided with the development kit allows sufficient cooling for the board to
operate up to a maximum power consumption of 150 W (under this environment).
Two MAX31730 3-channel remote temperature sensor devices are connected to the
Intel Agilex FPGA's internal temperature diodes. The function is to continuously
monitor the FPGA's internal core and transceiver tile die temperatures as well as the
board inlet and exhaust airflow temperatures when the board is installed inside a
server system. Based on the data from both temperature sensors, the Intel Agilex
FPGA and Intel MAX 10 run at its maximum speed whenever any temperature is over
60 °C or immediately power off the board whenever the temperature crosses 100 °C
to protect the board from damage.
Caution: Ensure you unplug the power supply when the board is powered off when the
temperature crosses 100 °C. Plug the power supply back again to ensure that the
board can be turned on or off again.
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2
C bus connects seven of these voltage regulator devices to the
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Intel Agilex F-Series FPGA (Two F-Tiles) Development Kit User Guide
rail for the
CC
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