Flip Chip-Plastic Ball Grid Array Package Diagram; Fc-Pbga Package (Top And Bottom Views); Datasheet - Intel IXF1104 Datasheet

®
Intel IXF1104 4-Port Gigabit Ethernet Media Access Controller
9.3.2

Flip Chip-Plastic Ball Grid Array Package Diagram

Figure 57 illustrates the FC-PBGA top and bottom package views and
PBGA mechanical specifications.
Note: Please contact your field sales representative for more information on the FC-PBGA package.
Figure 57. FC-PBGA Package (Top and Bottom Views)
TOP VIEW
// bbb (0.25)
BOTTOM VIEW
ł
e ee (0.25)
ł
f ff (0.10)
Notes:
All dimensions are in millimeters.
227
Terminal A01
Identifier
Lid
C
Substrate
Seating Plane
A B C
01
02
03
ł b
(0.55 min
0.75 max)
M C A B
M
C
Figure 58
D
25.0 Nom – 0.2
ddd (0.20)
e
Basic
1.00 mm
lists the FC-
A
aaa (0.20)
All around
E
25.0 Nom – 0.2
B
// ccc (0.35) C
A1
(0.40 min) A (3.27 max)
C
e
Basic
1.00 mm
Legend:
= No Ball
= Ball
B5181-02

Datasheet

Document Number: 278757
Revision Number: 009
Revision Date: 27-Oct-2005