Mechanical Specifications; Overview; Features; Package Specifics - Intel IXF1104 Datasheet

9.0

Mechanical Specifications

The IXF1104 MAC is packaged in a 576-ball BGA package with 6 balls removed diagonally from
each corner, for a total of 552 balls used measuring 25 mm x 25 mm. The pitch of the package balls
is 1 mm.
9.1

Overview

CBGA (standard and RoHS-compliant) and FC-PBGA packages are suited for applications
requiring high I/O counts and high electrical performance, and are recommended for high-power
applications with high noise immunity requirements.
Note: The FC-PBGA package will not be available until mid-2006. Please see your field sales
representative for more detailed information.
9.1.1

Features

•
Flip chip die attach; surface mount second-level interconnect
•
High electrical performance
•
High I/O counts
•
Area array I/O options
•
Multiple power-zone offering supports core and four additional voltages
•
JEDEC-compliant package
9.2

Package Specifics

The IXF1104 MAC uses the following package:
•
576-ball BGA package with 6 balls removed diagonally from each corner, for a total of 552
balls used
•
Ball pitch of 1.0 mm
•
Overall package dimensions of 25 mm x 25 mm

Datasheet

Document Number: 278757
Revision Number: 009
Revision Date: 27-Oct-2005
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Intel IXF1104 4-Port Gigabit Ethernet Media Access Controller
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