Bonding Modules - Allen-Bradley Ultra1500 2092-DA1 User Manual

1-12 Installing Your Ultra1500
Stud-mounting the subpanel
to the enclosure back wall
Subpanel
Star washer
Nut
mounting bracket
Publication 2092-UM001D-EN-P — July 2005

Bonding Modules

Unless specified, most paints are not conductive and they act as insulators. To
achieve a good bond between modules and the subpanel, surfaces need to be
paint-free or plated. Bonding metal surfaces creates a low-impedance exit path
for high-frequency energy.
IMPORTANT
Improper bonding blocks that direct exit path and allows high-frequency
energy to travel elsewhere in the cabinet. Excessive high-frequency energy can
effect the operation of other microprocessor controlled equipment. The
illustrations that follow (refer to Figure 1.3) show details of recommended
bonding practices for painted panels, enclosures, and mounting brackets.
Figure 1.3
Recommended Bonding Practices
Back wall of
enclosure
Welded
stud
Use a wire brush to remove paint from
threads to maximize ground
connection.
Use plated panels or scrape paint on
front of panel.
Bolt-mounting a ground bus or chassis to the back-panel
Ground bus or
Flat washer
Nut
Star washer
To improve the bond between the drive and subpanel,
construct your subpanel out of zinc plated (paint-free)
steel.
Stud-mounting a ground bus
or chassis to the subpanel
Mounting bracket or
ground bus
Flat washer
Nut
Star washer
Subpanel
Tapped hole
Nut
Scrape paint on both sides of
panel and use star washers.
Star washer
Flat washer
If the mounting bracket is coated with
a non-conductive material (anodized,
painted, etc.), scrape the material
around the mounting hole.
Subpanel
Welded stud
Scrape paint
Flat washer
If the mounting bracket is coated with
a non-conductive material (anodized,
painted, etc.), scrape the material
around the mounting hole.
Bolt
Star washer