Dc Specifications; Storage Condition Ratings - Intel 2ND GENERATION CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 Datasheet

Table 7-4.

Storage Condition Ratings

Symbol
T
absolute storage
T
sustained storage
T
short term storage
RH
sustained storage
Time
sustained storage
Time
short term storage
Notes:
1. Refers to a component device that is not assembled in a board or socket and is not electrically connected to
a voltage reference or I/O signal.
2. Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
3. T
absolute storage
moisture barrier bags, or desiccant.
4. Component product device storage temperature qualification methods may follow JESD22-A119 (low temp)
and JESD22-A103 (high temp) standards when applicable for volatile memory.
5. Intel branded products are specified and certified to meet the following temperature and humidity limits
that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28 °C.) Post board attach storage temperature limits
are not specified for non-Intel branded boards.
6. The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
7. Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
7.9

DC Specifications

The processor DC specifications in this section are defined at the processor
pins, unless noted otherwise. See
Chapter 6
• The DC specifications for the DDR3 signals are listed in
Sideband and Test Access Port (TAP) are listed in
• Table 7-5
meeting specifications for junction temperature, clock frequency, and input
voltages. Care should be taken to read all notes associated with each parameter.
• AC tolerances for all DC rails include dynamic load currents at switching frequencies
up to 1 MHz.
96
Parameter
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when exceeded for any length of
time.
The ambient storage temperature (in
shipping media) for a sustained period of time
The ambient storage temperature (in
shipping media) for a short period of time.
The maximum device storage relative
humidity for a sustained period of time.
A prolonged or extended period of time;
typically associated with customer shelf life.
A short-period of time;
applies to the unassembled component only and does not apply to the shipping media,
and customer shelf life in applicable Intel boxes and bags.
sustained storage
for signal definitions.
lists the DC specifications for the processor and are valid only while
Min
-25 °C
-5 °C
-20 °C
0 Months
0 hours
Chapter 8 for the processor pin listings and
Table
Table 7-12.
Electrical Specifications
Max Notes
125 °C 1, 2, 3, 4
40 °C 5, 6
85 °C
60% at 24 °C 6, 7
30 Months 7
72 hours
7-11. Control
Datasheet, Volume 1