Intel 2ND GENERATION CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 Datasheet page 5

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4.2.5.4
4.2.5.5
4.2.5.6
4.3 IMC Power Management..................................................................................... 55
4.3.1 Disabling Unused System Memory Outputs ................................................ 55
4.3.2 DRAM Power Management and Initialization ............................................... 56
4.3.2.1
4.3.2.2
4.3.2.3
4.3.2.4
4.4 PCIe* Power Management .................................................................................. 58
4.5 DMI Power Management..................................................................................... 58
4.6 Graphics Power Management .............................................................................. 59
4.6.1 Intel
4.6.2 Intel
4.6.3 Graphics Render C-State ......................................................................... 59
4.6.4 Intel
4.6.5 Intel
4.6.6 Display Power Savings Technology 6.0 (DPST) ........................................... 60
4.6.7 Automatic Display Brightness (ADB) ......................................................... 60
4.6.8 Seamless Display Refresh Rate Switching Technology (SDRRST)................... 61
4.7 Thermal Power Management ............................................................................... 61
5 Thermal Management .............................................................................................. 63
5.1 Thermal Design Power (TDP) and Junction Temperature (Tj) ................................... 63
5.2 Thermal Considerations...................................................................................... 63
5.2.1 Intel
5.2.2 Package Power Control............................................................................ 65
5.2.3 Power Plane Control................................................................................ 65
5.2.4 Turbo Time Parameter ............................................................................ 65
5.3 Thermal and Power Specifications........................................................................ 66
5.4 Thermal Management Features ........................................................................... 70
5.4.1 Processor Package Thermal Features......................................................... 70
5.4.1.1
5.4.1.2
5.4.1.3
5.4.2 Processor Core Specific Thermal Features .................................................. 75
5.4.2.1
5.4.3 Memory Controller Specific Thermal Features ............................................. 76
5.4.3.1
5.4.4 Platform Environment Control Interface (PECI) ........................................... 76
5.4.4.1
6 Signal Description ................................................................................................... 77
6.1 System Memory Interface .................................................................................. 78
6.2 Memory Reference and Compensation .................................................................. 79
6.3 Reset and Miscellaneous Signals.......................................................................... 80
6.4 PCI Express* Based Interface Signals................................................................... 80
6.5 Embedded DisplayPort (eDP) .............................................................................. 81
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6.6 Intel Flexible Display Interface Signals ............................................................... 81
6.7 DMI................................................................................................................. 81
6.8 PLL Signals....................................................................................................... 82
6.9 TAP Signals ...................................................................................................... 82
6.10 Error and Thermal Protection .............................................................................. 83
6.11 Power Sequencing ............................................................................................. 83
6.12 Processor Power Signals ..................................................................................... 84
Datasheet, Volume 1
Package C6 State...................................................................... 54
Package C7 State...................................................................... 55
Dynamic L3 Cache Sizing ........................................................... 55
Initialization Role of CKE ............................................................ 57
Conditional Self-Refresh ............................................................ 57
Dynamic Power-down Operation ................................................. 58
DRAM I/O Power Management .................................................... 58
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Rapid Memory Power Management (RMPM) (also know as CxSR)......... 59
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Graphics Performance Modulation Technology(GPMT) ........................ 59
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Smart 2D Display Technology (Intel
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Graphics Dynamic Frequency.......................................................... 60
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Turbo Boost Technology Power Control and Reporting........................ 64
Adaptive Thermal Monitor .......................................................... 70
Digital Thermal Sensor .............................................................. 72
PROCHOT# Signal..................................................................... 73
On-Demand Mode ..................................................................... 75
Programmable Trip Points .......................................................... 76
Fan Speed Control with Digital Thermal Sensor ............................. 76
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S2DDT) .................................. 59
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