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Related Manuals for Intel E6700 - Core 2 Duo Dual-Core Processor
Summary of Contents for Intel E6700 - Core 2 Duo Dual-Core Processor
- Page 1 ® Intel Core™2 Duo Processor ∆ ∆ ® E8000 and E7000 Series, Intel ® Pentium Dual-Core Processor ∆ ∆ E6000 and E5000 Series, and ® ® ∆ Intel Celeron Processor E3000 Series Thermal and Mechanical Design Guidelines November 2010 Document Number: 318734-017...
- Page 2 Intel accepts no liability for results if customer chooses at its discretion to implement these methods within its business operations. Intel makes no representations or warranties regarding the accuracy or completeness of the information provided. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained http://www.intel.com by calling 1-800-548-4725, or by visiting ®...
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Page 3: Table Of Contents
Contents Introduction ...................... 9 Document Goals and Scope ..............9 1.1.1 Importance of Thermal Management ..........9 1.1.2 Document Goals ................ 9 1.1.3 Document Scope ..............10 References .................... 11 Definition of Terms................. 11 Processor Thermal/Mechanical Information ............13 Mechanical Requirements ................ 13 2.1.1 Processor Package .............. - Page 4 Intel Quiet System Technology (Intel QST) ............63 ® Intel QST Algorithm ................63 7.1.1 Output Weighting Matrix ............64 7.1.2 Proportional-Integral-Derivative (PID) ......... 64 ® Board and System Implementation of Intel QST ........66 Thermal and Mechanical Design Guidelines...
- Page 5 Appendix A LGA775 Socket Heatsink Loading ................ 69 LGA775 Socket Heatsink Considerations ........... 69 ® Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel Reference Design ................... 69 Heatsink Preload Requirement Limitations ..........69 A.3.1 Motherboard Deflection Metric Definition........70 A.3.2...
- Page 6 Figure 5-2. Random Vibration PSD ..............44 Figure 5-3. Shock Acceleration Curve ..............44 ® Figure 5-4. Intel Type II TMA 65W Reference Design ........... 47 Figure 5-5. Upward Board Deflection During Shock ..........48 Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly Stiffness ....................
- Page 7 ® Figure 7-54. Intel E18764-001 Reference Solution Assembly ......124 Tables ® Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ..22 ® Table 2–2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions . 22 Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance39 Table 5–2.
- Page 8 Pentium dual-core processor E6800 ® ® • Added Intel Celeron processor E3500 August 2010 • Changed the processor numbering from Intel Celeron processor E3x00 series to Intel Celeron processor E3000 series. ® • Added Intel Pentium dual-core processor E5800 November 2010 §...
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Page 9: Introduction
The concepts given in this document are applicable to any system form factor. Specific examples used will be the Intel enabled reference solution for ATX/uATX systems. See the applicable BTX form factor reference documents to design a thermal solution for that form factor. -
Page 10: Document Scope
Chapter 4 addresses the benefits of the processor’s integrated thermal management logic for thermal design. Chapter 5 gives information on the Intel reference thermal solution for the processor in BTX platform. Chapter 6 gives information on the Intel reference thermal solution for the processor in ATX platform. -
Page 11: References
Material and concepts available in the following documents may be beneficial when reading this document. Material and concepts available in the following documents may be beneficial when reading this document. Document Location ® Intel Core™2 Duo Processor E8000 and E7000 Series www.intel.com/design/processor/d Datasheet atashts/318732.htm ® ®... - Page 12 Introduction Term Description Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. This is defined as: Ψ – T ) / Total Package Power. Ψ Note: Heat source must be specified for measurements. Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power.
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Page 13: Processor Thermal/Mechanical Information
Processor Thermal/Mechanical Information Processor Thermal/Mechanical Information Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. - Page 14 Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device.
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Page 15: Heatsink Attach
Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no features on the LGA775 socket to directly attach a heatsink: a mechanism must be designed to attach the heatsink directly to the motherboard. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular: •... -
Page 16: Additional Guidelines
Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guidelines: • Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material. -
Page 17: Thermal Profile
Chapter 6) should be designed to manage the processor TDP at an inlet temperature of 35 °C + 5°C = 40 °C. For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II reference design (see the Chapter 5) should be designed to manage the processor TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C. -
Page 18: Tcontrol
Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with 1 MB cache are defined such that there is a single thermal solution for all of the 775_VR_CONFIG_06 processors. -
Page 19: Heatsink Design Considerations
This is achieved in part by using the Ψ versus RPM and RPM versus Acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile would be expected to provide similar acoustic performance of different parts with potentially different T values. -
Page 20: Heatsink Size
Processor Thermal/Mechanical Information required to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases: it is more likely that the air travels around the heatsink instead of through it, unless air bypass is carefully managed. -
Page 21: Package Ihs Flatness
The attach mechanism (clip, fasteners, and so forth) are not included. The mass limit for BTX heatsinks that use Intel reference design structural ingredients is 900 grams. The BTX structural reference component strategy and design is reviewed in depth in the latest version of the Balanced Technology Extended (BTX) System Design Guide. -
Page 22: System Thermal Solution Considerations
40 °C 35.5 °C NOTE: Intel reference designs (E18764-001) for ATX assume the use of the thermally advantaged chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for TAC thermal and mechanical requirements). The TAC 2.0 Design Guide defines a new processor cooling solution inlet temperature target of 40 °C. -
Page 23: Summary
Socket documentation provides Best Known Methods for all aspects LGA775 socket based platforms and systems manufacturing. Of particular interest for package and heatsink installation and removal is the System Assembly module. A video covering system integration is also available. Contact your Intel field sales representative for further information. §... - Page 24 Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines...
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Page 25: Thermal Metrology
Thermal Metrology Thermal Metrology This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, Ψ (“psi”) will be used. Characterizing Cooling Performance Requirements The idea of a “thermal characterization parameter”, Ψ... -
Page 26: Example
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for illustrative purposes only. Thermal and Mechanical Design Guidelines... -
Page 27: Processor Thermal Solution Performance Assessment
Assessment Thermal performance of a heatsink should be assessed using a thermal test vehicle (TTV) provided by Intel. The TTV is a stable heat source that the user can make accurate power measurement, whereas processors can introduce additional factors that can impact test results. In particular, the power level from actual processors varies significantly, even when running the maximum power application provided by Intel, due to variances in the manufacturing process. - Page 28 Thermal Metrology For active heatsinks, it is important to avoid taking measurement in the dead flow zone that usually develops above the fan hub and hub spokes. Measurements should be taken at four different locations uniformly placed at the center of the annulus formed by the fan hub and the fan housing to evaluate the uniformity of the air temperature at the fan inlet.
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Page 29: Figure 3-3. Locations For Measuring Local Ambient Temperature, Passive Heatsink
Thermal Metrology Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink Note: Drawing Not to Scale Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Thermal and Mechanical Design Guidelines... -
Page 30: Processor Case Temperature Measurement Guidelines
Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when T is maintained at or below the thermal profile as listed in the datasheet. The measurement location for T is the geometric center of the IHS. Figure 2-2 shows the location for T measurement. -
Page 31: Thermal Management Logic And Thermal Monitor Feature
Fortunately, there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using more power efficient circuits can significantly reduce processor power consumption. -
Page 32: Prochot# Signal
Thermal Management Logic and Thermal Monitor Feature 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is to provide an external indication that the processor has reached the TCC activation temperature. While PROCHOT# is asserted, the TCC will be activated. Assertion of the PROCHOT# signal is independent of any register settings within the processor. -
Page 33: Thermal Monitor 2
Thermal Management Logic and Thermal Monitor Feature Figure 4-1. Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.3 Thermal Monitor 2 The second method of power reduction is TM2. TM2 provides an efficient means of reducing the power consumption within the processor and limiting the processor temperature. -
Page 34: Operation And Configuration
Thermal Management Logic and Thermal Monitor Feature Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to insure proper operation once the processor reaches its normal operating frequency. -
Page 35: On-Demand Mode
4.2.6 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a well designed processor thermal solution. -
Page 36: Operating System And Application Software Considerations
Thermal Management Logic and Thermal Monitor Feature A system designed to meet the thermal profile specification published in the processor datasheet greatly reduces the probability of real applications causing the thermal control circuit to activate under normal operating conditions. Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile. -
Page 37: Digital Thermal Sensor
Thermal Management Logic and Thermal Monitor Feature 4.2.10 Digital Thermal Sensor Multiple digital thermal sensors can be implemented within the package without adding a pair of signal pins per sensor as required with the thermal diode. The digital thermal sensor is easier to place in thermally sensitive locations of the processor than the thermal diode. -
Page 38: Platform Environmental Control Interface (Peci)
Set Overview. For additional information on the PECI, see the datasheet. The PECI bus is available on pin G5 of the LGA 775 socket. Intel chipsets beginning with the ICH8 have included PECI host controller. The PECI interface and the ®... -
Page 39: Balanced Technology Extended (Btx) Thermal/Mechanical Design Information
Performance targets (Ψ ca) as measured with a live processor at TDP. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with ® 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium ® ®... -
Page 40: Acoustics
) and the appropriate thermal performance with improved acoustics at lower fan inlet temperatures. Using the example in Table 5–2 for the Intel Core™2 Duo processor with 4 MB cache at T C-MAX 60.1 °C the required fan speed necessary to meet thermal specifications can be controlled by the fan inlet temperature and should comply with requirements in Table 5–2. -
Page 41: Effective Fan Curve
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.3 Effective Fan Curve The TMA must fulfill the processor cooling requirements shown in Table 5–1 when it is installed in a functional BTX system. When installed in a system, the TMA must operate against the backpressure created by the chassis impedance (due to vents, bezel, peripherals, and so forth) and will operate at lower net airflow than if it were tested outside of the system on a bench top or open air environment. -
Page 42: Voltage Regulator Thermal Management
VR power is not at a maximum or if the external ambient temperature is less than 35 ºC. This recommended airflow rate is based on the requirements for the Intel 965 Express Chipset Family. Thermal and Mechanical Design Guidelines... -
Page 43: Altitude
5.1.6 Reference Heatsink Thermal Validation The Intel reference heatsink will be validated within the specific boundary conditions based on the methodology described Section 5.2 , and using a thermal test vehicle. Testing is done in a BTX chassis at ambient lab temperature. The test results, for a number of samples, will be reported in terms of a worst-case mean + 3σ... -
Page 44: Shock Test Procedure
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Figure 5-2. Random Vibration PSD Vibration System Level + 3 dB Control Limit 0.01 - 3 dB Control Limit 0.001 0.0001 1000 5.2.1.2 Shock Test Procedure Recommended performance requirement for a system: • Quantity: 2 drops for + and - directions in each of 3 perpendicular axes (that is, total 12 drops). -
Page 45: Power Cycling
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (that is, motherboard, heatsink assembly, and so forth) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). -
Page 46: Recommended Bios/Cpu/Memory Test Procedures
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.3 Recommended BIOS/CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard that has not been exposed to any battery of tests prior to the test being considered. -
Page 47: Safety Requirements
BTX Interface Specification for Zone A, found at http://www.formfactors.org. ® Figure 5-4. Intel Type II TMA 65W Reference Design Development vendor information for the Intel Type II TMA Reference Solution is provided in Appendix H. Thermal and Mechanical Design Guidelines... -
Page 48: Preload And Tma Stiffness
5.6.1 Structural Design Strategy Structural design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions use the SRM and TMA that together resists local board curvature under the socket and minimize, board deflection (Figure 5-5). -
Page 49: Figure 5-6. Minimum Required Processor Preload To Thermal Module Assembly Stiffness
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Table 5–4. Processor Preload Limits Maximum Parameter Minimum Required Notes Allowed Processor Preload 98 N [22 lbf] 222 N [50 lbf] NOTES: These values represent upper and lower bounds for the processor preload. The nominal preload design point for the Thermal Module is based on a combination of requirements of the TIM, ease of assembly and the Thermal Module effective stiffness. -
Page 50: Figure 5-7. Thermal Module Attach Pointes And Duct-To-Srm Interface Features
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information mounting hole position for TMA attach, the required preload is approximately 10–15N greater than the values stipulated in Figure 5-6; however, Intel has not conducted any validation testing with this TMA mounting scheme. -
Page 51: Atx Thermal/Mechanical Design Information
This chapter will document the requirements for an active air-cooled design, with a fan installed at the top of the heatsink. The thermal technology required for the processor. The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core ®... -
Page 52: Figure 6-1. E18764-001 Reference Design - Exploded View
ATX Thermal/Mechanical Design Information Figure 6-1. E18764-001 Reference Design – Exploded View Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the processor in the 775-Land LGA package. -
Page 53: Validation Results For Reference Design
Performance targets (Ψ ca) as measured with a live processor at TDP. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel ®... -
Page 54: Acoustics
4 Wire PWM Controlled to implement fan speed control capability based digital thermal sensor temperature. Refer to Chapter 7 for further details. Note: Appendix F gives detailed fan performance for the Intel reference thermal solutions with 4 Wire PWM Controlled fan. -
Page 55: Heatsink Thermal Validation
6.2.4 Heatsink Thermal Validation Intel recommends evaluation of the heatsink within the specific boundary conditions based on the methodology described Section 6.3 , and using a thermal test vehicle. Testing is done on bench top test boards at ambient lab temperature. In particular, for the reference heatsink, the Plexiglas* barrier is installed 81.28 mm [3.2 in] above the... -
Page 56: Shock Test Procedure
ATX Thermal/Mechanical Design Information Figure 6-3. Random Vibration PSD 3.13GRMS (10 minutes per axis) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 5 Hz 500 Hz 0.001 1000 Frequency (Hz) 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (that is, total 18 drops). -
Page 57: Power Cycling
ATX Thermal/Mechanical Design Information 6.3.1.2.1 Recommended Test Sequence Each test sequence should start with components (that is, motherboard, heatsink assembly, and so forth) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). -
Page 58: Recommended Bios/Cpu/Memory Test Procedures
ATX Thermal/Mechanical Design Information 6.3.3 Recommended BIOS/CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard that has not been exposed to any battery of tests prior to the test being considered. -
Page 59: Safety Requirements
® Geometric Envelope for Intel Reference ATX Thermal Mechanical Design Figure 7-40, Figure 7-41, and Figure 7-42 in Appendix G provides detailed reference ATX/μATX motherboard keep-out information for the reference thermal/mechanical... -
Page 60: Reference Attach Mechanism
191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference design, in particular the clip and fastener. -
Page 61: Mechanical Interface To The Reference Attach Mechanism
ATX Thermal/Mechanical Design Information 6.7.2 Mechanical Interface to the Reference Attach Mechanism The attach mechanism component from the reference design can be used by other 3 party cooling solutions. The attach mechanism consists of: • A metal attach clip that interfaces with the heatsink core, see Appendix G, Figure 7-48 and Figure 7-49 for the component drawings. -
Page 62: Figure 6-7. Critical Parameters For Interfacing To Reference Clip
ATX Thermal/Mechanical Design Information Figure 6-7. Critical Parameters for Interfacing to Reference Clip Fin Array Fin Array Core Core See Detail A See Detail A Clip Clip Fin Array Fin Array Fin Array Fin Array Fin Array Fin Array 1.6 mm 1.6 mm 1.6 mm 1.6 mm... -
Page 63: Intel® Quiet System Technology (Intel® Qst)
The ME provides integrated fan speed control in lieu of the mechanisms available in a SIO or a stand-alone ASIC. The Intel QST is time based as compared to the linear or state control used by the current generation of FSC devices. -
Page 64: Output Weighting Matrix
7.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans. An example of how the matrix could be used is if a sensor located next to the memory is sensitive to changes in both the processor heatsink fan and a 2 fan in the system. -
Page 65: Figure 7-2. Pid Controller Fundamentals
Intel® Quiet System Technology (Intel® QST) temperature to the target temperature. As a result of its operation, the PID control algorithm can enable an acoustic-friendly platform. Figure 7-2. PID Controller Fundamentals Integral (time averaged) Integral (time averaged) Integral (time averaged) -
Page 66: Board And System Implementation Of Intel
Intel® Quiet System Technology (Intel® QST) ® Board and System Implementation of Intel To implement Intel QST, the board must be configured as shown in Figure 7-3 and listed below: • ME system (S0–S1) with Controller Link connected and powered •... -
Page 67: Figure 7-4. Example Acoustic Fan Speed Control Implementation
(see 0 for BTX recommendations for placement). Figure 7-4. Example Acoustic Fan Speed Control Implementation Intel has engaged with a number of major manufacturers of thermal / voltage sensors to provide devices for the SST bus. Contact your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for your design. -
Page 68: Intel Qst Configuration And Tuning
Intel QST subsystem to reflect the shipping system configuration. In the tuning process the Intel QST can be modified to have the proper relationships between the installed fans and sensors in the shipping system. A Weighting Matrix Utility and Intel QST Log program are planned to assist in optimizing the fan management and achieve acoustic goal. -
Page 69: Appendix Alga775 Socket Heatsink Loading
TIM performance AND LGA775 socket protection against fatigue failure. Metric for Heatsink Preload for ATX/uATX ® Designs Non-Compliant with Intel Reference Design Heatsink Preload Requirement Limitations Heatsink preload by itself is not an appropriate metric for solder joint force across... -
Page 70: Motherboard Deflection Metric Definition
LGA775 Socket Heatsink Loading Simulation shows that the solder joint force (F ) is proportional to the board axial deflection measured along the socket diagonal. The matching of F required to axial protect the LGA775 socket solder joint in temperature cycling is equivalent to matching a target MB deflection. -
Page 71: Board Deflection Limits
LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d’1 d’2 A.3.2 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL – d_ref≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm d’_BOL – d’_ref≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm NOTES: The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. -
Page 72: Board Deflection Metric Implementation Example
LGA775 Socket Heatsink Loading A.3.3 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 mm hole pattern of the reference design • Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep over time ... -
Page 73: Additional Considerations
A.3.4 Additional Considerations Intel recommends to design to {d_BOL - d_ref = 0.15 mm} at BOL when EOL conditions are not known or difficult to assess The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm... -
Page 74: Motherboard Stiffening Considerations
The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in its third party test house program to evaluate third party solutions. Vendor information now is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo §... -
Page 75: Appendix B Heatsink Clip Load Metrology
For example: • Heatsink preload for the LGA775 socket • Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. Test Preparation B.2.1 Heatsink Preparation... -
Page 76: Figure 7-8. Load Cell Installation In Machined Heatsink Base Pocket - Bottom View
Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design •... -
Page 77: Figure 7-9. Load Cell Installation In Machined Heatsink Base Pocket - Side View
Heatsink Clip Load Metrology Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 7-10. -
Page 78: Typical Test Equipment
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed in Table 7–2. Table 7–2. Typical Test Equipment Part Number Item Description (Model) Load cell Honeywell*-Sensotec* Model 13 subminiature AL322BL load cells, compression only Notes: 1, 5... -
Page 79: Time-Zero, Room Temperature Preload Measurement
Heatsink Clip Load Metrology B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis • For example: standard ATX board should sit on ATX compliant stand-offs. If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism. - Page 80 Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines...
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Page 81: Appendix C Thermal Interface Management
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area, and interface material thermal conductivity should be managed to realize the most effective thermal solution. - Page 82 Thermal Interface Management § Thermal and Mechanical Design Guidelines...
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Page 83: Appendix D Case Temperature Reference Metrology
The following supplier can do machining the groove and attaching a thermocouple to the IHS followed by the reference procedure. The supplier is listed the table below as a convenience to Intel’s general customers and the list may be subject to change without notice. -
Page 84: Figure 7-11. Omega Thermocouple
Case Temperature Reference Metrology Item Description Part Number Miscellaneous Hardware Solder Indium Corp. of America 52124 Alloy 57BI / 42SN / 1AG 0.010 Diameter Flux Indium Corp. of America 5RMA Loctite* 498 Super glue w/thermal characteristics 49850 Adhesive Adhesive Loctite* 7452 for fast glue curing 18490 Accelerator Kapton* Tape... -
Page 85: Thermal Calibration And Controls
It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process. -
Page 86: Figure 7-12. 775-Land Lga Package Reference Groove Drawing At 6 O'clock Exit
Case Temperature Reference Metrology Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit Thermal and Mechanical Design Guidelines... -
Page 87: Figure 7-13. 775-Land Lga Package Reference Groove Drawing At 3 O'clock Exit
Case Temperature Reference Metrology Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit (Old Drawing) Thermal and Mechanical Design Guidelines... -
Page 88: Figure 7-14. Ihs Groove At 6 O'clock Exit On The 775-Land Lga Package
Case Temperature Reference Metrology The orientation of the groove at 6 o’clock exit relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 7-14 for the 775-Land LGA package IHS. Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the... -
Page 89: Thermocouple Attach Procedure
Case Temperature Reference Metrology Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 – 155 °C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155 °C. -
Page 90: Thermocouple Attachment To The Ihs
Case Temperature Reference Metrology 5. Using the microscope and tweezers, bend the tip of the thermocouple at approximately 10 degree angle by about 0.8 mm [.030 inch] from the tip (Figure 7-17). Figure 7-17. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. -
Page 91: Figure 7-19. Thermocouple Bead Placement
Case Temperature Reference Metrology 9. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS (Figure 7-19-A and B). Figure 7-19. -
Page 92: Figure 7-20. Position Bead On The Groove Step
Case Temperature Reference Metrology 11. While still at the microscope, press the wire down about 6mm [0.125”] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 7-20). Refer to Figure 7-21 for detailed bead placement. -
Page 93: Figure 7-22. Third Tape Installation
Case Temperature Reference Metrology Figure 7-22. Third Tape Installation 12. Place a 3 piece of tape at the end of the step in the groove as shown in Figure 7-22. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. -
Page 94: Figure 7-24. Applying Flux To The Thermocouple Bead
Case Temperature Reference Metrology 14. Using a fine point device, place a small amount of flux on the thermocouple bead. Be careful not to move the thermocouple bead during this step (Figure 7-24). Ensure the flux remains in the bead area only. Figure 7-24. -
Page 95: Solder Process
Case Temperature Reference Metrology 16. Place the two pieces of solder in parallel, directly over the thermocouple bead (Figure 7-26). Figure 7-26. Positioning Solder on IHS 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. -
Page 96: Figure 7-27. Solder Station Setup
Case Temperature Reference Metrology Figure 7-27. Solder Station Setup 21. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper heater block at any time as this is very hot. -
Page 97: Figure 7-28. View Through Lens At Solder Station
Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (Figure 7-28 and Figure 7-29). Figure 7-28. -
Page 98: Cleaning And Completion Of Thermocouple Installation
Case Temperature Reference Metrology 25. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder. Figure 7-30. Removing Excess Solder 26. -
Page 99: Figure 7-31. Thermocouple Placed Into Groove
Case Temperature Reference Metrology Figure 7-31. Thermocouple placed into groove 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (Figure 7-32). Figure 7-32. Removing Excess Solder Note: Take usual precautions when using open blades 30. -
Page 100: Figure 7-33. Filling Groove With Adhesive
Case Temperature Reference Metrology 31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove (Figure 7-33). Figure 7-33. Filling Groove with Adhesive 32. -
Page 101: Figure 7-35. Removing Excess Adhesive From Ihs
Case Temperature Reference Metrology Figure 7-35. Removing Excess Adhesive from IHS 33. Using a blade, carefully shave any adhesive that is above the IHS surface (Figure 7-35). The preferred method is to shave from the edge to the center of the IHS. -
Page 102: Thermocouple Wire Management
Case Temperature Reference Metrology Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as Figure 7-37. This will keep the wire from getting damaged or pinched when removing and installing the heatsink. Note: When thermocouple wires are damaged, the resulting reading maybe wrong. -
Page 103: Appendix E Balanced Technology Extended (Btx) System Thermal Considerations
Balanced Technology Extended (BTX) System Thermal Considerations Appendix E Balanced Technology Extended (BTX) System Thermal Considerations There are anticipated system operating conditions in which the processor power may be low but other system component powers may be high. If the only Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor sensor then the fan speed and system airflow is likely to be too low in this operating state. -
Page 104: Figure 7-38. System Airflow Illustration With System Monitor Point Area Identified
Balanced Technology Extended (BTX) System Thermal Considerations The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 7-38 and Figure 7-39).The Intel Boxed Boards in the BTX form factor have implemented a System Monitor thermal sensor. -
Page 105: Figure 7-39. Thermal Sensor Location Illustration
Balanced Technology Extended (BTX) System Thermal Considerations Figure 7-39. Thermal sensor Location Illustration Thermal Sensor MCH Heatsink § Thermal and Mechanical Design Guidelines... - Page 106 Balanced Technology Extended (BTX) System Thermal Considerations Thermal and Mechanical Design Guidelines...
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Page 107: Appendix F Fan Performance For Reference Design
Fan Performance for Reference Design Appendix F Fan Performance for Reference Design The fan power requirements for proper operation are listed in Table 7–3. Table 7–3. Fan Electrical Performance Requirements Requirement Value Maximum Average fan current draw 1.5 A Fan start-up current draw 2.2 A Fan start-up current draw maximum 1.0 second... - Page 108 Fan Performance for Reference Design Thermal and Mechanical Design Guidelines...
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Page 109: Appendix G Mechanical Drawings
The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description Page Number ATX/µATX Motherboard Keep-out Footprint Definition and Height... -
Page 110: Figure 7-40. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height
Mechanical Drawings Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1 REVISION HISTORY ZONE DESCRIPTION DATE APPROVED 95.00 BOARD PRIMARY SIDE 72.00 1.93 1.09 SOCKET BALL 1 SOCKET BALLS 37.50 1.17 16.965 47.50 45.26 0.965 1.17... -
Page 111: Figure 7-41. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. BOARD SECONDARY SIDE 6.00 10.00 COMPONENT VOLUMETRIC... -
Page 112: Figure 7-42. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height
ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS 37.60 MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 49.00 SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 14.60 24.50 45 X 3.00... -
Page 113: Figure 7-43. Btx Thermal Module Keep Out Volumetric - Sheet 1
Mechanical Drawings Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1 Thermal and Mechanical Design Guidelines... -
Page 114: Figure 7-44. Btx Thermal Module Keep Out Volumetric - Sheet 2
Mechanical Drawings Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2 Thermal and Mechanical Design Guidelines... -
Page 115: Figure 7-45. Btx Thermal Module Keep Out Volumetric - Sheet 3
Mechanical Drawings Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3 Thermal and Mechanical Design Guidelines... -
Page 116: Figure 7-46. Btx Thermal Module Keep Out Volumetric - Sheet 4
Mechanical Drawings Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4 Thermal and Mechanical Design Guidelines... -
Page 117: Figure 7-47. Btx Thermal Module Keep Out Volumetric - Sheet 5
Mechanical Drawings Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5 Thermal and Mechanical Design Guidelines... -
Page 118: Figure 7-48. Atx Reference Clip - Sheet 1
Mechanical Drawings Figure 7-48. ATX Reference Clip – Sheet 1 DWG. NO SHT. C85609 94.62 3.725 REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER OF PART. SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET THE UL1439 TEST. 4X 10 0.2 .394 .007 0.5 [.019]... -
Page 119: Figure 7-49. Atx Reference Clip - Sheet 2
Mechanical Drawings Figure 7-49. ATX Reference Clip - Sheet 2 DWG. NO C85609 SHT. 7.31 .288 2X R0.5 .020 1.65 .065 45 X 0.45 0.05 1.06 .018 .001 .042 SECTION .209 .012 SCALE 2X R3.6 .142 0.1 [.003] 7.35 0.2 [.007] .289 BOUNDARY DETAIL... -
Page 120: Figure 7-50. Reference Fastener - Sheet 1
Mechanical Drawings Figure 7-50. Reference Fastener - Sheet 1 Thermal and Mechanical Design Guidelines... -
Page 121: Figure 7-51. Reference Fastener - Sheet 2
Mechanical Drawings Figure 7-51. Reference Fastener - Sheet 2 Thermal and Mechanical Design Guidelines... -
Page 122: Figure 7-52. Reference Fastener - Sheet 3
Mechanical Drawings Figure 7-52. Reference Fastener - Sheet 3 Thermal and Mechanical Design Guidelines... -
Page 123: Figure 7-53. Reference Fastener - Sheet 4
Mechanical Drawings Figure 7-53. Reference Fastener - Sheet 4 Thermal and Mechanical Design Guidelines... -
Page 124: Figure 7-54. Intel ® E18764-001 Reference Solution Assembly
Mechanical Drawings ® Figure 7-54. Intel E18764-001 Reference Solution Assembly Thermal and Mechanical Design Guidelines... -
Page 125: Intel Enabled Reference Solution Information
The following tables list suppliers that produce Intel enabled reference components. The part numbers listed below identifies these reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. OEMs and System Integrators are responsible for thermal, mechanical, and environmental validation of these solutions. -
Page 126: Table 7-6. Btx Reference Thermal Solution Providers
Intel® Enabled Reference Solution Information Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.
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