References; Terms And Definitions; Reference Documents - Intel Celeron D Thermal Design Manual

1.2

References

Material and concepts available in the following documents may be beneficial when reading this
document.
Table 1.

Reference Documents

Fan Specification for 4 Wire PWM Controlled Fans
®
Intel Celeron
in 775-Land Package
Intel® Pentium® 4 Processor 570/571, 560/561, 550/551, 540/541, 530/531
and 520/521 Supporting Hyper-Threading Technology Datasheet
®
Intel Pentium
Package Thermal Design Guide
LGA775 Socket Mechanical Design Guide
Performance ATX Desktop System Thermal Design Suggestions
Performance microATX Desktop System Thermal Design Suggestions
Server System Infrastructure Thin Electronics Bay Specifications
1.3

Terms and Definitions

Table 2. Terms and Definitions (Sheet 1 of 2)
Term
T
A
T
C
T
E
T
S
T
C-MAX
Ψ
CA
Ψ
CS
Ψ
SA
® ®
Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide7
303730
Order #
Document
®
D Processors 3xx Sequence Datasheet on 90nm Process
®
4 Processor on 90 nm Process in the 775-Land LGA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink. Also referred to as T
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
Heatsink temperature measured on the underside of the heatsink base, at a location
T
corresponding to
C.
The maximum case temperature as specified in a component specification.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Power.
NOTE: Heat source must be specified for
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Power.
NOTE: Heat source must be specified for
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
NOTE: Heat source must be specified for
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Description
LA
– T
C
Ψ
measurements.
– T
C
Ψ
measurements.
– T ) / Total Package Power.
S A
Ψ
measurements.
Introduction
Comment
) / Total Package
A
) / Total Package
S