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Thermal/Mechanical Reference Design
Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile A
65
T
60
55
50
45
40
0
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B
for the Quad-Core Intel® Xeon® Processor X5400 Series. From
sigma (mean+3sigma) performance of the thermal solution is computed to be
0.246°C/W and the processor local ambient temperature (T
is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-9.y = 0.246*X + 40
where,
y = Processor T
x = Processor power value (W)
Figure 2-20
Profile to the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile B with 0.5°C margin at
the upper end (TDP). However, as explained in
Profile B results in increased TCC activation and measurable performance loss for the
processor.
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
@ TDP
CASE_MAX_B
Thermal Profile A
Y = 0.168 * X + 42.8
5
10
15
20
25
30
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
2U CEK Reference Solution
Y = 0.187 * X + 40
35
40
45
50
55
60
65
Power (W )
Section
70
75
80
90
100
Table 2-7
the three-
) for this thermal solution
LA
2.2.7, designing to Thermal
120
110
TDP
43
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