Package Installation / Removal; Pick And Place Cover - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

LGA1156 Socket
Figure 3-6.

Pick and Place Cover

Pin 1 Pin 1
Pick & Place Cover Pick & Place Cover
3.5

Package Installation / Removal

As indicated in
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin 1 triangle and the soc ket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
Thermal/Mechanical Specifications and Design Guidelines
Figure 3-7, access is provided to facilitate manual installation and
ILM Installation ILM Installation
25