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2.4
Package Installation / Removal
As indicated in
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• As shown in
notch on the Pin 1 side. Similarly, space has been reserved for a "-2" mark on the
motherboard in the Board Keepin / Keepout Zones in
These matching marks help prevent system assemblers from installing the
incorrect processor into the socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
See
Appendix D
assistance during processor installation and removal.
.
Figure 2-6.
Package Installation / Removal Features
18
Figure
2-6, access is provided to facilitate manual installation and
Figure
2-7, the package substrate has a "-2" mark near the orientation
for information regarding a tool designed to provide mechanical
Figure B-1
and
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
LGA1356 Socket
Figure
B-2.
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