Package Mechanical Drawing; Processor Component Keep-Out Zones; Package View - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

2.1.1

Package Mechanical Drawing

Figure 2-2
mechanical drawings are in
design a thermal solution for the processor. These dimensions include:
1. Package reference with tolerances (total height, length, width, and so on)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.
Figure 2-2.

Package View

2.1.2

Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in. This keep-in
zone includes solder paste and is a post reflow maximum height for the components.
14
shows the basic package layout and dimensions. The detailed package
Appendix
37.5
Package Mechanical & Storage Specifications
D. The drawings include dimensions necessary to
Figure B-3
Thermal/Mechanical Specifications and Design Guidelines
and Figure B-4 for keep-