Package Mechanical Specifications; Package Mechanical Drawing; Processor Package Assembly Sketch - Intel Xeon Processor E5-1600 Datasheet

Package Mechanical Specifications

9
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that
interfaces with the baseboard via an LGA2011-0 land FCLGA10 socket. The package
consists of a processor mounted on a substrate land-carrier. An integrated heat
spreader (IHS) is attached to the package substrate and core and serves as the mating
surface for processor component thermal solutions, such as a heatsink.
shows a sketch of the processor package components and how they are assembled
together. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product
Families Thermal/Mechanical Design Guide for complete details on the LGA2011-0 land
FCLGA10 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 9-1.

Processor Package Assembly Sketch

Substrate
System Board
Note:
1. Socket and baseboard are included for reference and are not part of processor package.
9.1

Package Mechanical Drawing

The package mechanical drawings are shown in
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
Figure 9-1
Die
IHS
include the following:
TIM
Capacitors
LGA2011-0 Socket
Figure 9-2 and Figure
Figure 9-1
9-3. The
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