Package Mechanical Specifications; Package Mechanical Drawing; Processor Package Assembly Sketch - Intel HH80552PG0962M - Pentium 4 3.4 GHz Processor Datasheet

Package Mechanical Specifications

3 Package Mechanical
Specifications
The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package
that interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
the processor package components and how they are assembled together. Refer to the
LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 4.

Processor Package Assembly Sketch

System Board
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1

Package Mechanical Drawing

The package mechanical drawings are shown in
include dimensions necessary to design a thermal solution for the processor. These
dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in].
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal and
Mechanical Design Guidelines (see
Datasheet
Figure 4
Core (die)
IHS
Substrate
Figure 4
include the following:
TIM
Capacitors
Figure 5 and Figure
Section 1.2).
shows a sketch of
LGA775 Socket
6. The drawings
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