Table of Contents
Advertisement
3
Package Mechanical
Specifications
The Pentium 4 processor in the 775-land package is packaged in a Flip-Chip Land Grid Array
(FC-LGA4) package that interfaces with the motherboard via an LGA775 socket. The package
consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for processor
component thermal solutions, such as a heatsink.
package components and how they are assembled together. Refer to the LGA775 Socket
Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in
•
Integrated Heat Spreader (IHS)
•
Thermal Interface Material (TIM)
•
Processor core (die)
•
Package substrate
•
Capacitors
Figure 3-1. Processor Package Assembly Sketch
System Board
System Board
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in
dimensions necessary to design a thermal solution for the processor. These dimensions include:
•
Package reference with tolerances (total height, length, width, etc.)
•
IHS parallelism and tilt
•
Land dimensions
•
Top-side and back-side component keep-out dimensions
•
Reference datums
All drawing dimensions are in mm [in].
Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.
Datasheet
Core (die)
Core (die)
IHS
IHS
Substrate
Substrate
Package Mechanical Specifications
Figure 3-1
shows a sketch of the processor
Figure 3-1
include the following:
TIM
TIM
Figure 3-2
and
Capacitors
Capacitors
LGA775 Socket
LGA775 Socket
Figure
3-4. The drawings include
35
Advertisement
Table of Contents
