Bios Chipset; Winbond W83627Ehg Super I/O Chipset; Super I/O Lpc Interface - IEI Technology SPCIE-3600AM2 User Manual

2.5.2 BIOS Chipset:

The BIOS chipset has a licensed copy of AMI BIOS installed on the chipset. Some of the
BIOS features are listed below:
AMI Flash BIOS
SMIBIOS (DMI) compliant
Console redirection function support
PXE (Pre-boot Execution Environment) support
USB booting support

2.5.3 Winbond W83627EHG Super I/O chipset

The Winbond W83627EHG Super I/O chipset is connected to the MCP55Pro system
chipset through the LPC bus.
The Winbond W83627EHG is an LPC interface-based Super I/O device that comes with
Environment Controller integration, floppy disk controller, UART controller and IR
controller. Some of the features of the Winbond W83697HG chipset are listed below:
LPC Spec. 1.01 compliant
LDRQ# (LPC DMA) and SERIRQ (serial IRQ) supported
Hardware monitor functions integrated
Microsoft PC2000/PC2001 Hardware Design Guide compliant
ACPI DPM (Device Power Management) supported
Some of the Super I/O features are described in more detail below:

2.5.3.1 Super I/O LPC Interface

The LPC interface on the Super I/O complies with the Intel
Rev. 1.01. The LPC interface supports both LDRQ# and SERIRQ protocols as well as PCI
PME# interfaces.
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SPCIE-3600AM2 PICMG 1.3 CPU Card
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Low Pin Count Specification