ProSoft Technology inRax MVI69-PDPMV1 User Manual page 211

MVI69-PDPMV1 ♦ CompactLogix or MicroLogix Platform
PROFIBUS DPV1 Master
This example indicates the system components and devices in a system with
equipotential bonding.
Grounding and Shielding for Systems without Equipotential Bonding
Note: Grounding and shielding is to be carried out the same as for systems with equipotential
bonding.
If this is not possible because of system or construction specific reasons
however, use distributed ground with a capacitive coupling of high frequency
interference signals.
This representation shows distributed grounding with capacitive coupling.
ProSoft Technology, Inc.
July 8, 2011
Reference
User Manual
Page 211 of 225