General Specifications; Hardware Specifications - ProSoft Technology inRax MVI69-PDPMV1 User Manual

Reference
User Manual

6.1.1 General Specifications


Single-slot, 1769 backplane-compatible

The module is recognized as an Input/Output module and has access to
processor memory for data transfer between processor and module.

Ladder Logic is used for data transfer between module and processor. A
sample ladder file with AOI is included.

Configuration data obtained from configuration text file downloaded to
module. A sample configuration file is included.

Supports CompactLogix and MicroLogix 1500 LRP processors with 1769 I/O
bus capability and at least 800 mA of 5 Vdc backplane current.

CIPConnect
Configuration Builder and FDT comDTM via Ethernet routing using Rockwell
Automation Ethernet interface.

CIPConnect
processors.

6.1.2 Hardware Specifications

Specification
Dimensions
Current Load
Operating Temp.
Storage Temp.
Relative Humidity
LED Indicators
CFG Port (CFG)
Shipped with Unit
Page 158 of 225
®
enabled. Module supports communications with ProSoft
®
currently supports only L32E and L35E CompactLogix
Description
Standard 1769 single-slot module
800 mA max @ 5 Vdc
Power supply distance rating of 2 (L43 and L45
installations on first 2 slots of 1769 bus)
0°C to 60°C (32°F to 140°F)
-40°C to 85°C (-40°F to 185°F)
5% to 95% (with no condensation)
Power and Module Status
Application Status
Serial Port Activity
Serial Activity and Error Status
RJ45 (DB-9M with supplied cable)
RS-232 only
CIPconnect
L32E or 1769-L35E
RJ45 to DB-9M cables for each port
6-foot RS-232 configuration cable
MVI69-PDPMV1 ♦ CompactLogix or MicroLogix Platform
®
Ethernet routing when using 1769-
PROFIBUS DPV1 Master
ProSoft Technology, Inc.
July 8, 2011