Mechanical Data - Texas Instruments TMS320C6712D User Manual

TMS320C6712D
FLOATING POINT DIGITAL SIGNAL PROCESSOR
SPRS293 − OCTOBER 2005
package thermal resistance characteristics
The following tables show the thermal resistance characteristics for the GDP and ZDP mechanical packages.
thermal resistance characteristics (S-PBGA package) for GDP
NO
1 RΘ JC Junction-to-case
2 Psi JT Junction-to-package top
3 RΘ JB Junction-to-board
4 RΘ JA Junction-to-free air
5 RΘ JA Junction-to-free air
6 RΘ JA Junction-to-free air
7 RΘ JA Junction-to-free air
8 RΘ JA Junction-to-free air
9 Psi JB Junction-to-board
† m/s = meters per second
thermal resistance characteristics (S-PBGA package) for ZDP
NO
1 RΘ JC Junction-to-case
2 Psi JT Junction-to-package top
3 RΘ JB Junction-to-board
4 RΘ JA Junction-to-free air
5 RΘ JA Junction-to-free air
6 RΘ JA Junction-to-free air
7 RΘ JA Junction-to-free air
8 RΘ JA Junction-to-free air
9 Psi JB Junction-to-board
† m/s = meters per second
packaging information
The following packaging information and addendum reflect the most current released data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
98

MECHANICAL DATA

Two Signals, Two Planes (4-Layer Board)
Two Signals, Two Planes (4-Layer Board)
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
°C/W Air Flow (m/s) †
9.7 N/A
1.5 0.0
19 N/A
22 0.0
21 0.5
20 1.0
19 2.0
18 4.0
16 0.0
Air Flow (m/s) †
°C/W
9.7 N/A
1.5 0.0
19 N/A
22 0.0
21 0.5
20 1.0
19 2.0
18 4.0
16 0.0