Texas Instruments TMS320C6712D User Manual page 38

TMS320C6712D
FLOATING POINT DIGITAL SIGNAL PROCESSOR
SPRS293A − OCTOBER 2005 − REVISED NOVEMBER 2005
device and development-support tool nomenclature (continued)
PREFIX
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
DEVICE FAMILY
32 or 320 = TMS320 DSP family
TECHNOLOGY
C = CMOS
DEVICE
C6712D
† BGA =
Ball Grid Array
QFP = Quad Flatpack
‡ The ZDP mechanical package designator represents the version of the GDP with Pb−Free soldered balls. The ZDP package devices are
supported in the same speed grades as the GDP package devices (available upon request).
§ For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the TI website
(www.ti.com).
Figure 5. TMS320C6000 DSP Platform Device Nomenclature (Including the TMS320C6712D Device)
MicroStar BGA and PowerPAD are trademarks of Texas Instruments.
38
TMS 320 C 6712D GDP
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
( )
150
DEVICE SPEED RANGE
150 MHz
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
A = −40°C to 105°C, extended temperature
PACKAGE TYPE †‡§
GDP = 272-pin plastic BGA
ZDP = 272-pin plastic BGA, with Pb-free soldered balls