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Appendix D Package Dimensions
22.0 ± 0.2
108
109
144
1
0.22 ± 0.05
0.10 M
0.20 ± 0.04
Dimension including the plating thickness
Base material dimension
HD64411 Q2 User's Manual
Publication Date: 1st Edition, December 1997
Published by:
Edited by:
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
20
73
72
37
36
0.10
Figure D-1
Package Dimensions
Semiconductor and IC Div.
Hitachi, Ltd.
Technical Documentation Center
Hitachi Microcomputer System Ltd.
1.25
1.0
0.5 ± 0.1
Unit: mm
0° – 8°
221
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