IBM NeXtScale nx360 M4 Installation And Service Manual page 195

See "System-board layouts" on page 16 for more information about the locations of
the connectors, jumpers, and LEDs on the system board.
To remove the compute node, complete the following steps:
Battery holder
Left air baffle
1.8-inch solid state drive
2.5-inch Hard
disk drive
Figure 110. Major components of the compute node
1. Remove the cover (see "Removing the compute node cover" on page 110).
2. Remove all of the installed components in the following list from the compute
node; then, place them on a static-protective surface or install them on the new
compute node.
v DIMMs (see "Removing a memory module" on page 132).
v Air baffles (see "Removing the air baffle" on page 113).
v Hard disk drives and hard disk drive bay fillers (see "Removing a 3.5-inch
hard disk drive" on page 145, "Removing a 2.5-inch hard disk drive" on
page 147, and "Removing a 1.8-inch hard disk drive" on page 151).
v Microprocessors, heat sinks, and microprocessor heat-sink fillers. Use the
microprocessor installation tool that comes with the replacement
microprocessor to remove each microprocessor from the compute node and
install each one immediately in the new compute node (see "Removing a
microprocessor and heat sink" on page 165 and "Replacing a microprocessor
and heat sink" on page 168).
v Hard disk drive backplate (see "Removing the hard disk drive backplate" on
page 142).
If you are instructed to return the compute node, follow all packaging instructions,
and use any packaging materials for shipping that are supplied to you.
Cover
1.8-inch solid-state
drive cage
Heatsink
Heatsink
filler
PCI riser cage
3.5-inch Hard
disk drive
Chapter 5. Removing and replacing components
1.8-inch solid state
drive backplate
2.5-inch Hard disk
drive backplate
2.5-inch Hard disk
drive cage
3.5-inch Hard disk
drive cage
Microprocessor
DIMM
Right air baffle
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