IBM NeXtScale nx360 M4 Installation And Service Manual page 184

Figure 93. Heat sink removal
Microprocessor
release lever
Figure 94. Microprocessor socket levers and retainer disengagement
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IBM NeXtScale nx360 M4 Type 5455: Installation and Service Guide
4. Remove the air baffle (see "Removing the air baffle" on page 113).
5. Locate the microprocessor to be removed (see "System-board internal
connectors" on page 16).
6. Remove the heat sink.
Attention: Do not touch the thermal material on the bottom of the heat sink.
Touching the thermal material will contaminate it. If the thermal material on
the microprocessor or heat sink becomes contaminated, you must wipe off the
contaminated thermal material on the microprocessor or heat sink with the
alcohol wipes and reapply clean thermal grease to the heat sink.
a. Loosen the four screws on the corners of the microprocessor retainer.
b. Lift the heat sink out of the server. After removal, place the heat sink (with
the thermal grease side up) on a clean, flat surface.
7. Open the microprocessor socket release levers and retainer.
a. Identify which release lever is labeled as the first release lever to open and
open it.
b. Open the second release lever on the microprocessor socket.
Heat sink
Microprocessor
release lever
Microprocessor