A Component Suppliers - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
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Component Suppliers
A
Component Suppliers
Note:
The part numbers listed below identifies the reference components. End-users are
responsible for the verification of the Intel enabled component offerings with the
supplier. These vendors and devices are listed by Intel as a convenience to Intel's
general customer base, but Intel does not make any representations or warranties
whatsoever regarding quality, reliability, functionality, or compatibility of these devices.
Customers are responsible for thermal, mechanical, and environmental validation of
these solutions. This list and/or these devices may be subject to change without notice.
Table A-1.
Reference Heatsink
Item
2011D Heatsink
Assembly
RCFH7-1156 (DHA-A)
2011C Heatsink
Assembly
RCFH6-1156 (DHA-B)
Table A-2.
Reference Heatsink Components
Clip
Fastener
Table A-3.
LGA1155 Socket and ILM Components
Item
LGA1155 Socket
LGA115X ILM
without cover
LGA115X ILM with
cover
LGA115X ILM
cover only
LGA115X ILM
Back Plate
(with Screws)
Note:
Individual ILM covers are made availble for post-sales support
Thermal/Mechanical Specifications and Design Guidelines
Intel PN
E41759-002
E41997-002
Item
Intel PN
E36830-001
Base: C33389
Cap: C33390
Intel PN
Foxconn
E52846-002
PE115527-
4041-01F
E36142-002
PT44L61-6401
G11449-001
PT44L81-6401
G12451-001
012-1000-5377
E36143-002
PT44P19-6401
Delta
Foxconn
DTC-DAA07
1A01C7T00-
DHA_XA02
DTC-DAB03
1A01C7T00-
DHB_XA02
AVC
A208000389
N/A
Molex
475962032
2069570-1
475969911
2013882-3
475968711
2069838-8
475973003
1-2134503-1
475969930
2069838-2
Nidec
F90T12MS1Z7-
64A01A1
F90T12MS1Z7-
64A01B1
ITW
N/A
Base: C33389
Cap: C33390
Tyco
Lotes
N/A
ACA-ZIF-078-
Y02
ACA-ZIF-078-
Y17
ACA-ZIF-127-
K01
DCA-HSK-144-
Y09
103

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