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Thermal Solution Component Suppliers
A
Thermal Solution Component
Suppliers
A.1
Tall Torsional Clip Heatsink Thermal Solution
Heatsink Assembly includes:
• Heatsink
• Thermal Interface Material
• Torsional Clip
Heatsink (26.0 x 26.0 x 28.0 mm)
Thermal Interface
(PCM45F)
Heatsink Attach Clip
Solder-Down Anchor
Notes:
1.
Contact the supplier directly to verify time of component availability.
2.
Anchor is independent of heatsink assembly. Proper Anchor selection will protect the chipset heatsink from
shock and vibration.
Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
Intel Part
Part
Number
E20446-003
E21902-003
E20442-003
E20444-003
A13494-008
Supplier
Contact Information
(Part Number)
Chaun-Choung
Harry Lin (USA)
Technology Corp
714-739-5797
(CCI)
hlinack@aol.com
(00C95340103)
Monica Chih (Taiwan)
866-2-29952666, x131
(00C95350103)
monica_chih@ccic.com.tw
Chaun-Choung
Harry Lin (USA)
Technology Corp
714-739-5797
(CCI)
hlinack@aol.com
Monica Chih (Taiwan)
(NA)
866-2-29952666, x131
monica_chih@ccic.com.tw
Honeywell
Honeywell International, Inc.
PCM45 F*
Judy Oles (Customer Service)
(509)252-8605
(H245F15X15MMS)
judy.oles@honeywell.com
Andrew S.K. Ho (APAC)
(852)9095-4593
andrew.ho@honeywell.com
Andy Delano (Technical)
(509)252-2224
andrew.delano@honey-
well.com
Chaun-Choung
Harry Lin (USA)
Technology Corp
714-739-5797
(CCI)
hlinack@aol.com
Monica Chih (Taiwan)
(NA)
866-2-29952666, x131
monica_chih@ccic.com.tw
Foxconn
Hon Hai Precision Industry
Co., Ltd.
(HB9703E-W for
288 Mayo Ave.
0.062 inches thick
City of Industry, CA 91789
motherboard)
USA
(HB9703E-M3W for
Attn: Katie Wang (USA)
0.085 inches thick
katie.wang@foxconn.com
motherboard)
Tel:(909)978-6499
Fax:(909)978-6515
35
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