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Thermal Solutions
5
Thermal Solutions
This section describes a 1U reference heatsink and thermal design guidelines for the
Intel® Xeon® Processor E5-2400 Product Family.
5.1
Boundary Conditions
Table 5-1
generate processor thermal specifications and to provide guidance for heatsink design.
Table 5-1.
Values Used to Generate Processor Thermal Specifications
Parameter
Altitude, system
ambient temp
TDP
Ψ
1
CA
2
T
LA
3
Airflow
System height
(form factor)
Heatsink
volumetric
Heatsink
technology
Notes:
1. Max target (mean + 3 sigma + offset) for thermal characterization parameter
2. Local ambient temperature of the air entering the heatsink.
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).
Values above do not apply to LR-DIMM in an Intel Reference Design. Ducting is utilized to direct airflow.
5. Dimensions of heatsink do not include socket or processor.
6. Heatsink height + socket/processor height
(36 mm) in EEB Specification 2011, and with Maximum Component Height (33.5 mm) in SSI Compute Blade
Specification, both at http://www.ssiforum.org.
7. Passive heatsinks. PCM45F thermal interface material.
Table 5-2
expectations in Compact Electronics Bay. These values are not used to generate
processor thermal specifications, but may provide guidance for heatsink design.
Table 5-2.
Performance Expectations in Compact Electronics Bay (CEB)
Parameter
Altitude, system
ambient temp
TDP
1
T
LA
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
provides values for boundary conditions and performance targets used to
50W (4-
60W
core)
0.312
o
C/W
0.296
o
5
7
provides approximate boundary conditions and approximate performance
50W
60W
o
o
43.7
C
45.6
Value
o
Sea level, 35
70W
80W (4-core)
C/W
0.296
o
C/W
0.315
o
o
49
C
9.7 CFM @ 0.23" dP
4
1U (EEB)
90 x 90 x 25.5 mm (1U/SSI blade)
Cu base, Al fins
(Table
4-2) complies with TEB 1U Rack Height Constraints
Value
o
Sea level, 35
C
70W
80W (4-core)
o
o
C
46.8
C
48.1
C
80W (2-core,
95W
1 socket)
o
0.296
C/W
(8-core),
C/W
0.285
o
0.298
C/W
(6-core)
48.1
13 CFM @
0.28" dP
(non-specific,
1-socket)
6
(Section
5.4.1).
95W
50.0
o
C (8-core),
C
46.6
o
C (6-core)
o
C/W
o
C
1U
O.
2
33
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