System Thermal Solution Considerations; Chassis Thermal Design Capabilities; Improving Chassis Thermal Performance; Table 2-1. Heatsink Inlet Temperature Of Intel Reference Thermal Solutions - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual

2.4

System Thermal Solution Considerations

2.4.1

Chassis Thermal Design Capabilities

The Intel reference thermal solutions and Intel Boxed Processor thermal solutions
assume that the chassis delivers a maximum T
heatsink. The following tables show the T
and Intel Boxed Processor thermal solutions.
Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
Heatsink Inlet Temperature
NOTE:
1.
Table 2–2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
Heatsink Inlet Temperature
NOTE:
1.
2.4.2

Improving Chassis Thermal Performance

The heat generated by components within the chassis must be removed to provide an
adequate operating environment for both the processor and other system
components. Moving air through the chassis brings in air from the external ambient
environment and transports the heat generated by the processor and other system
components out of the system. The number, size and relative position of fans and
vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the
thermal solution and the amount of system airflow can be traded off against each
other to meet specific system design constraints. Additional constraints are board
layout, spacing, component placement, acoustic requirements, and structural
considerations that limit the thermal solution size. For more information, refer to the
Performance ATX Desktop System Thermal Design Suggestions or Performance
microATX Desktop System Thermal Design Suggestions or Balanced Technology
Extended (BTX) System Design Guide documents available on the
http://www.formfactors.org/
22
Topic
Intel reference designs (E18764-001) for ATX assume the use of the thermally
advantaged chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for
TAC thermal and mechanical requirements). The TAC 2.0 Design Guide defines a new
processor cooling solution inlet temperature target of 40° C. The existing TAC 1.1
chassis can be compatible with TAC 2.0 guidelines.
Topic Boxed Processor for Intel
E8000, E7000 Series, Intel
Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged
chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for TAC thermal
and mechanical requirements). The TAC 2.0 Design Guide defines a new processor
cooling solution inlet temperature target of 40° C. The existing TAC 1.1 chassis can be
compatible with TAC 2.0 guidelines.
web site.
Processor Thermal/Mechanical Information
at the inlet of the processor fan
A
requirements for the reference solutions
A
1
ATX E18764-001
40° C
Processor E6000, E5000 Series, and Intel
®
Celeron Processor E3000 Series
40° C
Thermal and Mechanical Design Guidelines
BTX Type II
35.5° C
®
Core™2 Duo Processor
® ®
Pentium Dual-Core
®