Lga1156 Socket And Ilm Electrical, Mechanical, And Environmental Specifications; Component Mass; Package/Socket Stackup Height; Socket Component Mass - Intel Core i7-800 Specifications

LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

5
LGA1156 Socket and ILM
Electrical, Mechanical, and
Environmental Specifications
This chapter describes the electrical, mechanical, and environmental specifications for
the LGA1156 socket and the Independent Loading Mechanism.
5.1

Component Mass

Table 5-1.

Socket Component Mass

Socket Body, Contacts and PnP Cover
ILM Cover
ILM Back Plate
5.2

Package/Socket Stackup Height

Table 5-2
LGA1156 socket with the ILM closed and the processor fully seated in the socket.
Table 5-2.

1156-land Package and LGA1156 Socket Stackup Height

Integrated Stackup Height (mm)
From Top of Board to Top of IHS
Socket Nominal Seating Plane Height
Package Nominal Thickness (lands to top of IHS)
Notes:
1. This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor datasheet.
2. The integrated stackup height value is a RSS calculation based on current and planned processors that will
use the ILM design.
Thermal/Mechanical Specifications and Design Guidelines
Component
provides the stackup height of a processor in the 1156-land LGA package and
Component
Mass
10 g
29 g
38 g
Stackup Height
7.781 ± 0.335 mm
3.4 ± 0.2 mm
4.381 ± 0.269 mm
Appendix C, (b) the height of the package, from the
Note
2
1
1
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