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PENTIUM® PRO PROCESSOR AT 150, 166, 180, and 200 MHz
Table 26. Ambient Temperature Required per Heat Sink Height for 40 W and 85° ° Case
Airflow (LFM):
2
With 0.5" Heat Sink
With 1.0" Heat Sink
2
With 1.5" Heat Sink
2
2
With 2.0" Heat Sink
NOTES:
1.
At sea level. See Table 24.
2.
Heat Sink design as in Table 24.
7.0.
MECHANICAL SPECIFICATIONS
The Pentium Pro processor is packaged in a
modified staggered 387 pin ceramic pin grid array
(SPGA) with a gold plated Copper-Tungsten (CuW)
heat spreader on top. Mechanical specifications and
the pin assignments follow.
7.1.
Dimensions
The mechanical specifications are provided in
Table 27. Figure 42 shows the bottom and side views
64
T
vs. Airflow [Linear Feet per Minute] and Heat Sink Height
A
100
200
—
—
—
18
18
32
26
35
400
600
3
18
41
47
49
53
50
55
with package dimensions for the Pentium Pro
processor and Figure 43 shows the top view with
dimensions. Figure 44 is the top view of the Pentium
Pro processor with V CC P, V CC S, V CC 5, and V SS
locations shown. Be sure to read Section 8 for the
mechanical
constraints
processor. Also, investigate the tools that will be
used to debug the system before laying out the
system.
E
1
800
1000
28
33
53
54
56
58
57
59
for
the
OverDrive
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