Assembly Of Ilm To A Motherboard; Back Plate - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

Independent Loading Mechanism (ILM) and Back Plate
Figure 3-2.

Back Plate

3.2

Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. In step
1 (see Figure
provide alignment to the threaded studs.
In step 2, the ILM assembly is placed over the socket and threaded studs. The Intel
Reference Design ILM cover is not designed to nest over the Pick and Place cover. This
feature helps prevent reinstallation of the Pick and Place cover, a step that can lead to
socket bent contacts.
To prevent the ILM cover from popping off during ILM assembly, the load plate can be
unlatched from the load lever when the fasteners are torqued as shown is Step 3. Using
a T20 Torx* driver, fasten the ILM assembly to the back plate with the four captive
fasteners. Torque to 9 ± 1 inch-pounds.
The Pick and Place cover can then be removed as shown in Step 4, and the load plate
can then closed and latched as shown in Step5.
The length of the threaded studs accommodate board thicknesses from
0.062" to 0.100".
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
3-3), the back plate is placed in a fixture. Holes in the motherboard
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