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Package Mechanical Specifications
3.5
Package Insertion Specifications
The Pentium 4 processor in the 775-land package can be inserted into and removed from a
LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass
[weight] includes all the components that are included in the package.
3.7
Processor Materials
Table 3-3
Table 3-3. Processor Materials
Integrated Heat Spreader (IHS)
3.8
Processor Markings
Figure 3-5
identification of the Pentium 4 processor in the 775-land package.
Figure 3-5. Processor Top-Side Marking Example
40
lists some of the package components and associated materials.
Component
Substrate
Substrate Lands
and
Figure 3-6
show the topside markings on the processor. These diagrams aid in the
Frequency/L2 Cache/Bus/
775_VR_CONFIG_04x
S-Spec/Country of Assy
FPO
2-D Matrix Mark
Material
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
©
'04
m
INTEL
®
Pentium 4
3.60GHz/1M/800/04B
SLxxx [COO]
[FPO]
ATPO
S/N
Unique Unit
Identifier
ATPO Serial #
Datasheet
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