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3.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7
Processor Materials
Table 21
Table 21.
Processor Materials
Integrated Heat Spreader
Substrate Lands
3.8
Processor Markings
Figure 9
identification of the processor.
Figure 9.
Processor Top-Side Markings Example
38
lists some of the package components and associated materials.
Component
(IHS)
Substrate
shows the topside markings on the processor. This diagram is to aid in the
INTEL
Intel® Pentium® Dual-Core
SLAY7 [COO]
2.50GHZ/2M/800/06
[FPO]
Package Mechanical Specifications
Material
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
©'06 E5200
M
e
4
ATPO
S/N
Datasheet
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