Ruijie RG-RAP73Pro Cookbook page 18

Installation Guide
2.2.5 Cleanliness
Dust poses a major threat to the device. The indoor dust can cause electrostatic adhesion when falling on the
device, causing poor contact of the metallic joint. Such electrostatic adhesion occurs more easily when the
indoor relative humidity is low, not only affecting the service life of the device, but also causing communication
failure easily. The following table lists the requirements on the dust content and diameter in the equipment room.
Table 2-1 Dust and Particles
Particle Size
≥ 0.5 μm
≥ 1 μm
≥ 3 μm
≥ 5 μm
Apart from dust, the salt, acid, and sulfide in the air of the equipment room must meet strict requirement. These
harmful substances will accelerate metal corrosion and component aging. The equipment room should be
protected from harmful gases (such as sulfur dioxide, hydrogen sulfide, nitrogen dioxide, ammonia, and chlorine).
The following table lists the limits of harmful gases in the equipment room.
Table 2-2 Hazardous Gases
Gas
Sulfur dioxide (SO
Hydrogen sulfide (H
Nitrogen dioxide (NO
Ammonia gas (NH
Chlorine gas (CI
Note
The average value is measured over one week. The maximum value is the upper limit of the harmful gas
measured in one week for up to 30 minutes every day.
2.2.6 EMI

Keep the AP as far away from the grounding equipment of the power device and the lightning prevention
equipment as possible.

Keep the device away from radio stations, radar stations, high-frequency and high-current devices,
microwave ovens, and other high-power wireless devices.
Unit
Particles/m
Particles/m
Particles/m
Particles/m
Average (mg/m
) 0.2
2
S) 0.006
2
) 0.04
2
) 0.05
3
) 0.01
2
Content
≤ 1.4 x 10
3
≤ 7 x 10
3
≤ 2.4 x 10
3
≤ 1.3 x 10
3
3
)
10
Preparing for Installation
7
5
5
5
3
Maximum (mg/m )
1.5
0.03
0.15
0.15
0.3