Grounding; Cooling Considerations - SMART Embedded Computing AXP1440-C07 Installation And Use Manual

During installation of the shelf make sure to follow these guidelines:
During the course of handling, shipping, and assembly, pins, shrouds and

mounting screws, fans and other items can become loose or damaged.
Do not operate a damaged shelf, this can cause damage to devices that interface

with it.
Do not remove shipping frame stiffeners until positioning is complete and all bolts

are fully tightened. Mounting without frame stiffeners may cause warping of the
shelf.
Always lift the shelf from the bottom/base of the shelf.

Do not lift the shelf at the internal card cage.

Lifting at internal card cage may cause warping of the shelf and prevent proper

insertion of blade products.
Do not lift the shelf at the front upper fan tray or top front of shelf. Lifting at these

points may cause warping of the shelf and prevent proper EMI sealing or damage
to the fan tray.
3.3.2

Grounding

To ensure the AXP1440-C07 is properly grounded, check each of the shelf's parts to make
sure they contact the EMI gasket. The shelf contains gaskets at the shelf and module level.
The shelf is fitted with ESD contacts.
Put on an ESD wrist strap.
Connect the strap to the shelf by attaching the front or rear ESD jack.
3.3.3

Cooling Considerations

The AXP1440-C07 shelf is PICMG 3.7 R1 class B.4 compliant. Refer to the PICMG
specification for comprehensive cooling considerations.
The cooling subsystem provides for greater than 40CFM for the front blade and

5.0CFM for the RTM.
The actual cooling performance depends on the slot population and the heat sink

design of installed blades and should be validated based on the used
configuration.
The distance to other equipment must be sufficient to avoid system overheating.

The cooling subsystem is designed to provide 31.1CFM in the front and presence

of any single cooling failure.
AXP1440-C07 Installation and Use (6806800V18A)
Site Preparation
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