Preconditioning And Moisture Sensitivity; Tray Specifications - Intel PXA27 Series Design Manual

2.8

Preconditioning and Moisture Sensitivity

With most surface mount components, if the units are allowed to absorb moisture beyond a certain
point, package damage occurs during the reflow process. Refer to Chapter 8 in the Intel
Packaging Data Book at
preconditioning and moisture sensitivity requirements. Specific moisture classification levels are
defined on the box label for the product.
2.9

Tray Specifications

This subsection describes the JEDEC tray specifications for configuring pick and place units. The
JEDEC tray specifications for the VF-BGA are provided in a later revision.
Figure 2-10. FS-CSP (14x14) Tray Specification
®
Intel PXA27x Processor Family Design Guide
http://www.intel.com/design/PACKTECH/packbook.htm
PCB Design Guidelines
®
for package
I:2-13