Table Of Contents - Intel PXA27 Series Design Manual

Contents
Part I
1 Introduction to Part I ...............................................................................................................I: 1-1
1.1 Document Organization and Overview ...........................................................................I: 1-1
1.2 Functional Overview .......................................................................................................I: 1-2
1.3 Package Introduction ......................................................................................................I: 1-3
1.4 Signal Pin Descriptions ...................................................................................................I: 1-4
2 PCB Design Guidelines...........................................................................................................I: 2-1
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2.1 Intel Flash Memory Design Guidelines .........................................................................I: 2-1
2.2 General PCB Characteristics ..........................................................................................I: 2-1
2.2.1 PCB Layer Assignment (Stackup) .....................................................................I: 2-2
2.2.2 PCB Component Placement ..............................................................................I: 2-4
2.2.3 PCB Escape Routing .........................................................................................I: 2-7
2.2.3.1
2.2.3.2
2.2.3.3
2.2.4 PCB Keep-out Zones .......................................................................................I: 2-11
2.2.5 Recommended Mobile Handset Dimensions...................................................I: 2-11
2.3 Power Supply Decoupling Requirements .....................................................................I: 2-12
2.4 Thermal Considerations................................................................................................I: 2-12
2.5 Package to Board Assembly Process...........................................................................I: 2-12
2.6 Silicon Daisy Chain (SDC) Evaluation Units .................................................................I: 2-12
2.7 Handling: Shipping Media .............................................................................................I: 2-12
2.8 Preconditioning and Moisture Sensitivity ......................................................................I: 2-13
2.9 Tray Specifications .......................................................................................................I: 2-13
3 Design Check List ...................................................................................................................I: 3-1
4 Mixed Voltage Design Considerations ..................................................................................I: 4-1
4.1 Overview .........................................................................................................................I: 4-1
4.2 Required Power Supplies ...............................................................................................I: 4-1
4.3 Example Power Supply Utilizing Minimal Regulators .....................................................I: 4-2
4.4 Cautions..........................................................................................................................I: 4-4
5 Power Measurements..............................................................................................................I: 5-1
5.1 Overview .........................................................................................................................I: 5-1
5.2 Measurement Guidelines ................................................................................................I: 5-1
5.2.1 Measure Voltage Across a Series Resistor .......................................................I: 5-1
5.2.2 Measure Current Directly with a Current Meter in Series ..................................I: 5-1
5.3 Achieve Minimum Power Usage During All Power Modes .............................................I: 5-2
5.4 Achieve Minimum Power Usage During Deep Sleep .....................................................I: 5-2
5.5 Achieve Minimum Power Usage During Sleep ...............................................................I: 5-3
5.6 Achieve Minimum Power Usage During Standby ...........................................................I: 5-3
5.7 Achieve Minimum Power Usage During Idle/13M/Run/Turbo ........................................I: 5-3
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Intel PXA27x Processor Family Design Guide
VF-BGA Escape Routing ...................................................................I: 2-8
FS-CSP Escape Routing ...................................................................I: 2-9
PBGA Escape Routing.....................................................................I: 2-10
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