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DISCRETE COMPONENT INSTALLATION
26)
Insert and solder the fourteen .1 uf dis k capacitors at
locations Cll through C24 as shown on the Assembly Diagram.
27)
Insert and solder the four 33 uf tantalum capacitors at
locations Cl through C4 as shown on the Assembly Diagram.
NOTE:
Observe polarity (+ to +) as shown on the board.
28)
Insert and solder the two 1N914 zener diodes at locations
CRl and CR4 as shown on the Assembly Diagram.
29)
Insert and solder the two 1N742 zener diodes at locations
CR2 and CR3 as shown on the Assembly Diagram.
30)
Insert and solder the two 2N3904 transistors at locations
Q1 and Q2 as shown on the Assembly Diagram for SIO 2.-2;
or the one 2N3904 transistor at location Q1 as shown on
the Assembly Diagram for SIO 2-1.
31)
Insert and s older the eight 16 pin
Al, A3/ AS, B8, Bll, D3, and D6 for SIO 2-2; or the seven
16 pin sockets at locations Al, A3, A S , .Bll, D 3 , and D6
for SIO 2-1 as shown on the A s s embly Diagram.
REGULATOR AND HEAT SINK INSTALLATION
32) ; Before installing the heat sink and regulator, bend the
7805 regulator leads at 90 degree angles to facilitate
m ounting of the heat sink.
33)
Insert the' £6 screw through the 7805 regulator and heat
sink on the component side of the board and attach through
the lockwasher and nut on the circuit side of the board.
Tighten the screw carefully to insure proper alignment
of the heat sink to prevent shorting to adjacent, traces
Solder in the 7805 leads.
34)
Finally, the 8251 chips should be inserted in their sockets
w ith Pin 1 down toward the 100 pin edge connector at the
bottom of the board.
should be installed and other option jumpers installed
as required.
Addressing and baud rate jumpers
The board is ready for use.
Assembly Instructions
sockets at locations
9 - 1 9
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