Remove the Motherboard Assembly
See
d.
Remove the server top cover.
See
2.
Remove the Oracle Storage 12 Gb/s SAS PCIe RAID HBA card and its associated
super capacitor.
See
"Remove the Sun Storage 12 Gb/s SAS PCIe RAID HBA Card" on page
Remove the air baffle.
3.
Remove the air baffle by lifting the baffle up and out of the server.
4.
Remove the following reusable components:
Caution -
with the slot numbers from which they were removed (PS0, PS1). This is required because the
power supplies must be reinstalled into the slots from which they were removed; otherwise, the
server key identity properties (KIP) data might be lost. When a server requires service, the KIP
is used by Oracle to verify that the warranty on the server has not expired. For more information
on KIP, see
Fan modules
■
See
SAS storage drive cables
■
See
PCIe cards
■
See
Power supplies
■
See
5.
Disconnect the power cable from the motherboard to the rear storage drive
backplane [1].
See
"Servicing the Storage Drive Backplanes" on page
6.
Disconnect the ribbon cables from the left front I/O module and right front I/O
modules [1].
146
Oracle Exadata Storage Server X5-2 High Capacity Service Manual • January 2018
"Take Antistatic Measures" on page
"Remove the Server Top Cover" on page
During the motherboard removal procedure, it is important to label power supplies
"FRU Key Identity Properties (KIP) Automated Update" on page
"Remove a Fan Module" on page
"Remove SAS Storage Drive Cables" on page
"Remove a PCIe Card" on page
"Remove a Power Supply" on page
57.
58.
67.
118.
88.
73.
112.
124.
49.
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