Chapter 24 Recommended Soldering Conditions - NEC 78K0S/KB1+ User Manual

These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Cautions 1.
2. For soldering methods and conditions other than those recommended below, contact an NEC
30-pin plastic SSOP
μ
<R>
PD78F9232MC-5A4, 78F9234MC-5A4, 78F9232MC(A)-5A4
μ
PD78F9232MC(A2)-5A4
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Notes 1. Under development
2. After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).

CHAPTER 24 RECOMMENDED SOLDERING CONDITIONS

Products with -A at the end of the part number are lead-free products.
Electronics sales representative.
Table 24-1. Surface Mounting Type Soldering Conditions (1/2)
Note 1
, 78F9234MC(A2)-5A4
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
Note 2
limit: 7 days (after that, prebake at 125°C for 20 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note 1
, 78F9234MC(A)-5A4
Note 1
Soldering Conditions
Note 2
(after that, prebake at 125°C for
Note 2
(after that, prebake at 125°C for
User's Manual U17446EJ3V1UD
Note 1
,
Recommended
Condition Symbol
IR35-207-3
VP15-207-3
WS60-207-1
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