Removing The Heat-Sink Retention Module - Lenovo TD200 - ThinkServer - 3809 Hardware Maintenance Manual

4. Use a clean area of the cleaning pad to wipe the thermal grease from the microprocessor; then, dispose
of the cleaning pad after all of the thermal grease is removed.
1
0.02 mL of thermal grease
2
Microprocessor
5. Use the thermal-grease syringe to place 9 uniformly spaced dots of 0.02 mL each on the top of
the microprocessor. The outermost dots must be within approximately 5 mm of the edge of the
microprocessor, this is to ensure uniform distribution of the grease.
Note: If the grease is properly applied, approximately half of the grease will remain in the syringe.
6. Install the heat sink onto the microprocessor as described in "Installing a microprocessor and heat
sink" on page 189.

Removing the heat-sink retention module

To remove the heat-sink retention module, complete the following steps.
Step 1. Read the safety information that begins on page (see Chapter 2 "Safety information" on page 3).
Step 2. Turn off the server and all attached devices; then, disconnect all power cords and external cables.
Step 3. Carefully lay the server on its side so that it is lying flat and facing up.
Note: Do not allow the server to fall over.
Step 4. Unlock and remove the side cover (see "Removing the side cover" on page 146).
Step 5. Rotate the power-supply cage assembly out of the chassis. Lift up the power-supply cage handle
and pull the power-supply cage assembly all the way up until the retainer latch locks the cage in
place on the chassis.
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ThinkServer TD200 Hardware Maintenance Manual