Lenovo TD200 - ThinkServer - 3809 Hardware Maintenance Manual page 196

1
Power supply
2
Power-supply handle
Step 6. Remove the air baffle (see "Removing the air baffle" on page 147).
Step 7. Disconnect any cables that impede access to the heat sink and microprocessor.
Step 8. Remove the heat sink from the microprocessor.
Attention: The microprocessor release latch is spring-loaded when the microprocessor is in place.
Releasing the latch too quickly or allowing it to spring upward can damage the microprocessor and
surrounding components.
Step 9. Lift the heat-sink release lever and slowly move it upward to the fully open position.
1
Microprocessor
2
Retainer bracket
3
Heatsink release level
4
Alignment tab
Important: Be careful when you handle the microprocessor and heat sink. If the microprocessor
and heat sink will be reused, do not contaminate the thermal grease between them.
Step 10. Tilt the heat sink to the side to remove it from the lower flange of the retainer bracket; then, remove
it from the server. After removal, place the heat sink on its side on a clean, flat surface.
Step 11. Release the microprocessor release latch by pressing down on the end, moving it to the side, and
slowly releasing it to the open (up) position.
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ThinkServer TD200 Hardware Maintenance Manual