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2.10 Cooling conditions
2.10.1 Air flow
The following describes the airflow of the
(1) Hitachi WAN Accelerator
Figure 2-6 Hitachi WAN Accelerator
Exhaust
2.10.2 Cooling conditions for the Device on a table
Ensure at least 70 mm of space for airflow on all sides of the Device.
Do not block the ventilation slots. Otherwise, the internal heat is not discharged, which
might cause a fire. Ensure at least 70 mm of space from ventilation slots.
When equipment with forced air cooling systems is installed near the Device,
NOTE
interference due to the airflow from multiple devices can adversely affect the cooling of
the Device, which might result in a malfunction.
Maintain enough space or place a partition between equipment to prevent airflow
interference.
Note that if a partition is installed, it must be at least 70 mm away from the side panel of
the Device.
The exhaust airflow from nearby equipment might be drawn into the Device, and
the air intake temperature of the Device might exceed the environment
requirements.
When nearby equipment has too strong an intake or exhaust air system, reverse
air pressure might affect the Device airflow, decreasing the internal cooling
performance.
Device
.
Intake
57
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