Hitachi H8/3637 Hardware Manual page 400

Dimensional drawings of the H8/3637 Series in FP-80B, TFP-80F and TFP-80C packages are
shown in figure F.1, F.2 and F.3, respectively.
64
65
80
1
*0.37 ± 0.08
0.35 ± 0.06
*Dimension including the plating thickness
Base material dimension
Note: In case of inconsistencies arising within figures, dimensional drawings listed in the
Hitachi Semiconductor Packages Manual take precedence and are considered correct.
Appendix F Package Dimensions
24.8 ± 0.4
20
41
24
0.15 M
0.8
0.15
Figure F.1 FP-80B Package Dimensions
40
25
Unit: mm
2.4
1.0
0° – 10°
1.2 ± 0.2
399