Lenovo BladeCenter HS23E Problem Determination And Service Manual page 160

v Follow the suggested actions in the order in which they are listed in the Action column until the problem is
solved.
v See Chapter 4, "Parts listing," on page 41 to determine which components are consumable, structural, or CRU
parts.
v If an action step is preceded by "(Trained technician only)," that step must be performed only by a trained
technician.
Error Code Event ID
806f0023-2101ffff
0x806f0028 806f0028-2101ffff
0x806f0107 806f0107-0301ffff
806f0107-0302ffff
146
BladeCenter HS23E Type 8038 and 8039: Problem Determination and Service Guide
Type Error Message
Info Watchdog Timer
expired for sensor
(IPMI Watchdog).
Warning Sensor (TPM Cmd
Failures) is
unavailable or
degraded on
management
system.
Error Processor X (CPU
X)
Over-Temperature
Condition has been
detected. [Note:
X=1,2]
Action
Information only; no action is required.
1. Restart the server.
2. If the problem remains, or the server
cannot be restarted successfully, (trained
technician only) replace the system board
(see "Removing the system-board
assembly" on page 90 and "Installing the
system-board assembly" on page 91).
1. Make sure that the room temperature is
within the operating specifications (see
"Features and specifications" on page 7).
2. Make sure that none of the air vents on
the BladeCenter unit and on the blade
server are blocked.
3. Make sure that all of the fans on the
BladeCenter unit are running.
4. Make sure that each bay of the
BladeCenter unit has either a device or a
filler installed.
5. Make sure that the blade server is not
missing any heat sinks, DIMMs, heat-sink
fillers, or DIMM fillers (see Chapter 4,
"Parts listing," on page 41).
6. Make sure that the CPU heat sink is
properly attached to the CPU (see
"Installing a microprocessor and heat
sink" on page 84).
7. (Trained technician only) If the error still
occurs, replace the microprocessor that
controls the failing memory module. See
"Removing a microprocessor and heat
sink" on page 81 and "Installing a
microprocessor and heat sink" on page
84.